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TISP4xxxJ1BJ Overvoltage Protector Series
Electrical Characteristics, TA = 25 ° C (Unless Otherwise Noted) (Continued)
Parameter
Test Conditions
Min
Typ
Max
Unit
I (BO)
Breakover current
dv/dt = ± 250 V/ms,
R SOURCE = 300 ?
± 600
mA
I H
dv/dt
Holding current
Critical rate of rise of
off-state voltage
I T = ± 5 A, di/dt = +/-30 mA/ms
Linear voltage ramp, Maximum ramp value < 0.85 V DRM
± 20
± 5
mA
kV/ μ s
I D
Off-state current
V D = ± 50 V
f = 1 MHz,
Vd = 1 V rms, V D = 0,
T A = 85 ° C
‘4070 thru ‘4115
195
± 10
235
μ A
‘4125 thru ‘4219
‘4250 thru ‘4395
120
105
145
125
f = 1 MHz,
Vd = 1 V rms, V D = -1 V
‘4070 thru ‘4115
‘4125 thru ‘4219
‘4250 thru ‘4395
180
110
95
215
132
115
C off
Off-state capacitance
f = 1 MHz,
Vd = 1 V rms, V D = -2 V
‘4070 thru ‘4115
‘4125 thru ‘4219
165
100
200
120
pF
‘4250 thru ‘4395
90
105
f = 1 MHz,
Vd = 1 V rms, V D = -50 V
‘4070 thru ‘4115
‘4125 thru ‘4219
‘4250 thru ‘4395
85
50
42
100
60
50
f = 1 MHz, Vd = 1 V rms, V D = -100 V
(see Note 4)
‘4125 thru ‘4219
‘4250 thru ‘4395
40
35
50
40
NOTE 4: To avoid possible voltage clipping, the ‘4125 is tested with V D = -98 V
Thermal Characteristics
Parameter
R θ JA Junction to free air thermal resistance
Test Condit ions
EIA/JESD51-3 PCB, I T = I TSM(1000) ,
T A = 25 ° C, (see Note 5)
Min
Typ
Max
90
Unit
° C/W
NOTE 5: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.
SEPTEMBER 2001 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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